銅母材上におけるすず-鉛はんだのひろがり性に及ぼす塩化亜鉛溶剤中へのフッ化物およびヨウ化物添加の効果

概要

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The objective of this study is to clarify the effect of the chemical displacement reaction between Sn-Pb solder and ZnCl_2 binary system fluxes containing fluorides or iodides as a second component on the spreadability of Sn-Pb solder. The results obtained are summarized as follows. (1) when ZnCl_2 binary system fluxes containing fluorides such as AgF, BiF_3 and NiF_2 4H_2O or iodides such as AgI, BiI_3 and NiI_2・6H_2O were used, a remarkable chemical displacement reaction between Sn-Pb solder and the fluxes took place and the spread area of the solder with these fluxes was larger than that with pure ZnCl_2 flux. (2) When ZnCl_2 binary system fluxes containing fluorides such as ZnF_2, MnF_2, KF, NaF, LiF and BaF_2 or iodides such as ZnF_2 and CdF_2 Were used, the chemical displacement reaction hardly took place and the spread area was almost the same as that with pure ZnCl_2.
社団法人日本材料学会の論文
1979-10-15