Pb の Hot dip coating に関する研究(第 2 報) : 銅塩化物と Sn-Pb ろうの置換反応について

概要

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As reported in previous paper, the chemical displacement reaction between flux and solder or base metal can be determined by free energy of formation of metal chloride. In this report, authors describe to-behavious of CuCl, CuCl_2 or CuO in ZnCl_2 flux. CuCl or CuCl_2 existing in molten ZnCl_2 react with Sn-Pb solder to displace Cu. The spread area of Sn-Pb solder on Cu plate is increaded due to Cu produced by this displacement reaction between flux and solder. The spread area of solder is governed by test temp., composition of Sn-Pb solder and added quantity of CuCl or CuCl_2 to ZnCl_2. In this case, the spreading characteristics may be classified into three different categories. Namely (1) The marked sccondary spreading causes in definite range of test temperature. (2) The marked sceondary spreading causes at all range of test temperature. (3) The slight secondary spreading causes at all range of test temperature. When flux added CuO to ZnCl_2 aqu. solution is used, the spreading characteristic of Sn-Pb solder with this flux on Cu plate is similar to ZnCl_2-CuCl or ZnCl_2-CuCl_2 fluxes. Namely, when ZnCl_2 aq. solution is concentrated on heating, HCl is produced. This HCl reacts with CuO to produce CuCl or CuCl_2
社団法人溶接学会の論文
1973-11-25