Behavior of Wave-Soldered Joints by Sn-Cu System Lead-Free Solders

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概要

• 論文の詳細を見る
• 社団法人電子情報通信学会の論文
• 2002-11-01

著者

• Nishimura Tetsuro

  Nihon Superior Co. Ltd.

関連論文

• The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race
• Microstructure Control in Sn-0.7 mass%Cu Alloys
• Behavior of Wave-Soldered Joints by Sn-Cu System Lead-Free Solders
• Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders

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