Microstructure Control in Sn-0.7 mass%Cu Alloys
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2005-11-20
著者
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Nogita Kazuhiro
Materials Engineering The University Of Queensland
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Dahle Arne
Materials Engineering The University Of Queensland
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Nishimura Tetsuro
Nihon Superior Co. Ltd.
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Sweatman Keith
Nihon Superior Co. Ltd.
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READ Jonathan
Materials Engineering, The University of Queensland
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SUENAGA Shoichi
Nihon Superior Co., Ltd.
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Read Jonathan
Materials Engineering The University Of Queensland
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Suenaga Shoichi
Nihon Superior Co. Ltd.
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Nishimura Tetsuro
Nihon Superior Co., Ltd.
関連論文
- Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints
- The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race
- Microstructure Control in Sn-0.7 mass%Cu Alloys
- Behavior of Wave-Soldered Joints by Sn-Cu System Lead-Free Solders
- Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders