Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders

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概要

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• The authors found inhibition of cracking in the interfacial Cu6Sn5 intermetallic when Ni containing Sn–0.7Cu alloy was used for soldering. It is thought that this crack inhibition occurred due to the stabilisation of the high temperature hexagonal Cu6Sn5 phase through the presence of Ni from a Sn–0.7Cu–0.05Ni solder alloy. To explore the mechanisms associated with the differences in joint integrity, in-situ synchrotron X-ray diffraction (XRD) at the Australian Synchrotron was conducted in the temperature range of 25 to 200°C. The results show that Ni stabilises a high-temperature allotrope of the Cu6Sn5 phase, avoiding stresses induced by a volumetric change that would otherwise occur on phase transformation.

著者

• Nogita Kazuhiro

  Materials Engineering The University Of Queensland

• Nishimura Tetsuro

  Nihon Superior Co. Ltd.

• Read Jonathan

  Materials Engineering The University Of Queensland

• Suenaga Shoichi

  Nihon Superior Co. Ltd.

• McDonald Stuart

  Materials Engineering, The University of Queensland

• Tsukamoto Hideaki

  Materials Engineering, The University of Queensland

関連論文

• Synchrotron Micro-XRF Measurements of Trace Element Distributions in BGA Type Solders and Solder Joints
• The Performance of Lead-Free Solders During a Long-Distance Electric Vehicle Race
• Microstructure Control in Sn-0.7 mass%Cu Alloys
• Behavior of Wave-Soldered Joints by Sn-Cu System Lead-Free Solders
• Inhibiting Cracking of Interfacial Cu6Sn5 by Ni Additions to Sn-based Lead-free Solders

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