An Advanced BSG Self-Aligned (A-BSA) Transistor Technology for High Speed IC Implementation

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This paper reports on a high-speed silicon bipolar transistor with an f_T and f_<MAX> of over 40 GHz, we call it the Advanced Boro-silicated-glass Self-Aligned (A-BSA) transistor. In basic BSA technology, a CVD-BSG film is used not only as a diffusion source to form the intrinsic base and the link base regions but also as a sidewall spacer between the emitter and the base polysilicon electrodes. An A-BSA transistor offers three advancements to this technology: (1) a graded collector profile underneath the intrinsic base region to suppress the Kirk effect;(2) an optimized design of the link base region to prevent the trade-off effect between f_T and base resistance; and (3) a newly developed buried emitter electrode structure, consisting of an N^<++>-polysilicon layer, a platinum silicide layer, and a CVD tungsten plug, to prevent the emitter plug effect. Furthermore,our transistor uses a BPSG filled trench isolation to reduce parasitic capacitance and improve circuit performance. In this paper, we describe device design, process technology and characterization of the A-BSA transistor, with it we have performed several application ICs, operating at l0 Gb/s and above. The A-BSA transistor achieved an f_T of 41 GHz and an f_<MAX> of 44GHz under optimized conditions.
社団法人電子情報通信学会の論文
1996-12-25