A New Autofocus Using Image Processing Techniques in Critical Dimension Measurement SEM(Special Issue on Test and Diagnosis of VLSI)

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概要

• 論文の詳細を見る

• We have developed a new autofocus method using image processing techniques. This method consists of two steps. The first step is the preset of an objective lens condition with the aid of the feedback of Z-sensor. Next, a hole pattern to be measured is detected using the pattern recognition. In the second step, the E-beam is shifted to the center of a hole pattern and scanned across the axis of a pattern. The exciting current of the objective lens is changed at constant intervals, where the center position of the range is the preset value of the Z-sensor. The best focus condition is determined based on the signal profile obtained by the autofocus scan. The measurement repeatability(3σ)can be achieved within 3.9nm. The percentage of success of 98.7% can be realized in the present autofocus method.

• 社団法人電子情報通信学会の論文
• 1998-07-25

著者

• Miyoshi M

  Toshiba Corp. Yokohama Jpn

• Miyoshi Motosuke

  Toshiba Corp. Integrated Circuit Advanced Process Engineering Department

• Komatsu F

  Kagawa Nutrition Univ.

• KOMATSU Fumio

  Toshiba Corp., Integrated Circuit Advanced Process Technology Dept.

• MOTOKI Hiroshi

  Toshiba Corp., Integrated Circuit Advanced Process Technology Dept.

• Motoki Hiroshi

  Toshiba Corp. Integrated Circuit Advanced Process Technology Dept.

関連論文

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• Effect of the Electron-Irradiation-Induced-Contamination of the Etching Process of a Photoresist
• Voltage Contrast Defect Inspection of Contacts and Vias for Deep Quarter Micron Devices
• A New Autofocus Using Image Processing Techniques in Critical Dimension Measurement SEM(Special Issue on Test and Diagnosis of VLSI)

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