Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding (Special Issue on High-Frequency/speed Devices in the 21st Century)
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概要
- 論文の詳細を見る
This paper describes a new millimeter-wave hybrid integrated circuit (HIC) technology which applies a thin film multi-layered dielectric substrate and flip-chip bonding technology employing stud bump bonding (SBB). We have previously proposed and demonstrated a novel HIC structure, named millimeter-wave flip-chip IC, (MFIC), applying an excellent dielectric material of benzocyclobutene (BCB) thin film and flip-chip bonding. In this paper, an advanced thin film multilayer process using non-photosensitive BCB was newly developed. Characteristics of the transmission lines and the built-in MIM capacitor within the multi-layered structure were discussed. Furthermore, stud bump bonding was newly adapted to the MFIC as a flip-chip method, and the millimeter-wave characteristics of the bumps were examined. Using these technologies, we demonstrate characteristics of a miniaturized 25 GHz down converter MFIC. Our newly proposed HIC structure enabled us to bring down chip size to less than 1/3 of our conventional structure. Finally, we discuss future possibilities for high performance multi-chip-modules (MCMs) using SBB technology as a further improved HIC for compact millimeter-wave radio equipment.
- 社団法人電子情報通信学会の論文
- 1999-11-25
著者
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Ogura H
Matsushita Electric Industrial Co. Ltd. Kawasaki‐shi Jpn
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TAKAHASHI Kazuaki
Mobile Communication Research Laboratory, Matsushita Research Institute Tokyo, Inc.
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SAGAWA Morikazu
Mobile Communication Research Laboratory, Matsushita Research Institute Tokyo, Inc.
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Sagawa Morikazu
Mobile Communication Research Laboratory Matsushita Research Institute Tokyo Inc.
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OGURA Hiroshi
Opto-Electro Mechanics Research Laboratory, Matsushita Research Institute Tokyo Inc.
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Takahashi Kazuaki
Mobile Communication Research Laboratory Matsushita Research Institute Tokyo Inc.
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SAGAWA Morikazu
Mobile Communication Research Laboratory, Matsushita Research Institute Tokyo Inc.
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- A Novel Millimeter-Wave IC on Si Substrate Using Flip-Chip Bonding Technology
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- A Compact V-Band Filter/Antenna Integrated Receiver IC Built on Si-Micromachined BCB Suspended Structure(Special Issue on Millimeter-Wave Circuits and Fabrication Technologies Opening up the 21st Century)
- Miniaturized Millimeter-Wave Hybrid IC Technology Using Non-Photosensitive Multi-Layered BCB Thin Films and Stud Bump Bonding (Special Issue on High-Frequency/speed Devices in the 21st Century)