High Frequency Flip-Chip Bonding Technologies and Their Application to Microwave/Millimeter-Wave ICs(Special Issue on Microwave and Millimeter-Wave Module Technology)

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概要

• 論文の詳細を見る

• This paper describes new IC design concepts using flip-chip bonding technologies for microwave and millimeter-wave circuit integration. Two types of bonding technologies, stud bump bonding(SBB)and micro bump bonding(MBB)are introduced, and their applications to microwave and millimeter-wave ICs are presented. Receiver front-end hybrid IC(HIC)for cellular and PHS handsets using SBB and new millimeter-wave ICs on Si substrate called millimeter flip-chip IC(MFIC)using MBB have been designed and fabricated to prove their advantages. These flip-chip bonding technologies are experimentally proven to provide excellent solutions for high performance and compact-sized ICs with low-cost. The HIC concept is applicable consistently over a wide range of devices from RF/microwave to millimeter-wave region.

• 社団法人電子情報通信学会の論文
• 1998-06-25

著者

• Yoshida Takeshi

  Graduate School Of Advanced Sciences Of Matter Hiroshima University

• Sakai Hiroyuki

  Electronics Research Laboratory Corporate Research & Development Matsushita Electronics Corporat

• Yoshida T

  Graduate School Of Advanced Sciences Of Matter Hiroshima University

• YOSHIDA Takayuki

  Production Engineering Center, Matsushita Electronics Corportation

• SAGAWA Morikazu

  Mobile Communication Research Laboratory, Matsushita Research Institute Tokyo, Inc.

• Sagawa M

  Matsushita Res. Inst. Tokyo Inc. Kawasaki‐shi Jpn

• Sagawa Morikazu

  Mobile Communication Research Laboratory Matsushita Research Institute Tokyo Inc.

• Yoshida Takayuki

  Production Engineering Center Matsushita Electronics Corporation

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