半導体デバイスとの集積化を目指した薄膜インダクタの作製

概要

論文の詳細を見る
We fabricated thin-film inductors for integration with semiconductor devices. Ni-Fe magnetic thin films made by rf magnetron sputtering were used for the inductors. We determined the sputtering conditions for obtaining a magnetic thin film. The inductor has a spiral coil sandwiched between upper and lower magnetic thin films. Aluminum was used as the spiral coil, and polyimide was used as an insulator. And also, we presented the integration of the thin-film inductors with semiconductor devices. As a result, the fabrication of the magnetic devices did not affect the properties of the semiconductor devies.
社団法人日本磁気学会の論文
1999-04-15