TED-AJ03-638 Investigation of the Heat Transfer Limits in Thin Capillary Wicks of Phase-Change Cooling Devices
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概要
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The continual reductions in size and ever-increasing numbers of ICs contained on a single chip results in a power density that is becoming increasingly challenging to meet and requires the development of novel, advanced cooling techniques. Flat heat spreaders that utilize phase change and are capable of distributing heat uniformly present one of several promising new cooling devices for the dissipation of heat from high power-density microelectronic devices at very low thermal resistances. Because the phase-change heat transfer occurring in the capillary wick structure directly determines the performance of the devices, investigation of the mechanism is of vital importance in the development and design of these devices. In the current investigation, a mathematical model has been developed to numerically evaluate the evaporation heat transfer limits in thin capillary wick layers and the effects of those capillary wick structures on the evaporation heat transfer process. Sintered metal powder wick layers with different structural and physical characteristics were studied. The effects of layer thickness, porosity, thermal conductivity and permeability on the capillary and boiling limits have been evaluated. In addition, the effect of the size and location of the heat source also have been investigated. The results indicate that for sintered powder layers, increasing the particle diameter improves the capillary heat transfer rate but lowers the boiling limit. The maximum heat flux on the heat source can be significantly increased through the spreading of the heat that takes place through phase change in the porous layer. Consequently, the heat flux and resulting maximum temperature occurring on the heat source is reduced. Modeling results indicate that the maximum capillary evaporation heat transport capacity of these sintered powder layers can reach heat fluxes as high as 1600 W/(cm)^2,that the capillary limit is the dominant factor in lower operating temperatures, and that boiling may occur at higher operating temperatures, prior to reaching capillary limit.
- 一般社団法人日本機械学会の論文
著者
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Wang Y.
Department Of Electrical Engineering National Cheng Kung University
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CHEN Q.
Department of Electrical Engineering University of Tokyo
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Peterson G.
Department Of Mechanical Aerospace & Nuclear Engineering Rensselaer Polytechnic Institute
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