超音波による接着・はく離の非破壊評価

概要

論文の詳細を見る
Delamination in plastic-encapsulated integrated circuit packaging can lead to premature failure and also decrease heat resistivity. Therefore, development of nondestructive inspection of the bondind surface in a plastic package is an important subject for reliability improvement of integrated circuits. In this paper, delamination at the resin-chip interface which is measured using ultrasonic testing is discussed. At the delamination surface, the phase of reflected ultrasonic waves is reversed and at the bonding surface it is not. By using this phenomena, bonding and delamination can be discriminated. Delamination filled with water is also discussed. In this case, characteristic variation with frequency of ultrasound used is available for measurement of the gap thickness.
一般社団法人日本機械学会の論文
1992-02-25