B25-075 Characterization of MEMS Materials : Micro-Nano Physics Underlying MEMS

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概要

• 論文の詳細を見る

• The importance of materials characterization for design and fabrication of MEMS devices is discussed by showing two examples. The first example is on the materials properties related to fabrication process. Anisotropic etching properties of single-crystal silicon using alkaline solutions were evaluated as functions of crystallographic orientations. It has been clarified that the anisotropy varies depending on etching solutions regardless of the numbers of dangling bond of surface atoms. This fact well explains the change in macroscopic etching phenomena according to the change in etching conditions. The second example is on the strength of thin film materials that can be different from that of bulk materials. We proposed a new method for uni-axial tensile test of thin films. The test was performed on a silicon chip where the thin film specimen and the loading mechanism had been integrated. Fracture behaviors, such as fracture strength and fracture toughness, were evaluated for thin films in a range of 0.1 to 20 microns thick.

• 一般社団法人日本機械学会の論文
• 2003-11-30

著者

• Shikida Mitsuhiro

  Dept. Of Micro System Engineering Nagoya University

• SATO Kazuo

  Dept. of Micro System Engineering, Nagoya University

• ANDO Taeko

  Dept. of Micro-Nano Systems Engineering, Nagoya University

• Ando Taeko

  Dept. Of Micro System Engineering Nagoya University

• Sato Kazuo

  Dept. Of Micro System Engineering Nagoya University

関連論文

• Analysis of Structure & Material-Property Effects On a Thermal Type Fingerprint Sensor
• 特集論文 Anisotropy of Fracture Strength and Fracture Toughness of Micro-Sized Single-Crystal Silicon (特集:MEMS/NEMS材料特性および信頼性評価)
• B25-075 Characterization of MEMS Materials : Micro-Nano Physics Underlying MEMS
• OS6(1)-2(OS06W0033) Measurement of the Fracture Toughness of Micrometer Scale Single Crystal Silicon by Tensile Test Method

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