低角入射X線法によるセラミックスの研削残留応力分布の評価

概要

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A new method was proposed to estimate nondestructively the steep distribution of residual stress in the surface layerof ground ceramics with the use of the glancing incidence X-ray diffraction method. In the estimation, we assumed an exponential decrement of the residual stress near the surface, and derived a formula for the strain measured by X-rays as a function of sin^2ψ. Experimentally, we obtained the strain for a very wide range of sin^2ψ from heavily ground silicon nitride by the glancing incidence X-ray diffraction method. A strong nonlinearity was found in sin^2ψ diagram at very high ψ-angles, that is at very shallow penetration depths of X-rays. From the analysis of the nonlinearity by our new method, the stress distribution in the surface layer was determined. The residual stress took the amximum compression of about 2000 MPa at 0.4 μm from the surface, and then diminished at about 10 μm in depth.
社団法人日本材料学会の論文
1993-06-15