[111]繊維配向を有するアルミニウム薄膜のX線残留応力測定

概要

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A new method of X-ray stress measurement was applied to the measurement of residual stress in aluminum thin films sputtered on(100)oriented silicon single-crystal wafers. The film has the[111]fiber texture perpendicular to the film surface. The strain was measured from Al 222 and 311 diffractions obtained by Cr-K_α radiation. The values of in-plane residual stresses σ_<11> σ_<22> and out-of-plane normal residual stress, σ_<33> were determined from the measured strains by using the fundamental formulae derived on the basis of Reuss and Voigt models. The residual stress in the thin films was nearly equi-biaxial tension, and its magnitude decreased with increasing film thickness. The residual stress determined by the curvature method was nearly equal to the value determined by the X-ray method.
社団法人日本材料学会の論文
1996-10-15