硬ぜい材料の微細工具による切削加工

概要

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Maiy reports on the cutting of hard and brittle materials such as single crystalline silicon and glass have been published so far, however, obtainable shapes have been limited because only turning tools or indenters have been used for cutting tools. From this point of view, in this study, an end mill-like microtool was adopted in order to machine by cutting three-dimensional microshapes with a high aspect ratio on these materials. The tool with a D-shaped cross section and a diameter of 20μm was fabricated using microelectrodischarge machining. With this tool, cutting of single crystalline silicon and glass was carried out at an axial depth of cut of 0.2μm. As a result, a slot of 25μm depth was successfully machined on silicon. Scanning electron microscope observation of the machined surface showed that the ductile-mode cutting was realized. A slot of 60μm depth was machined on glass, however, cutung was performed in the brittle mode. This indicates that, under the machining conditions for these experiments, the critical depth of cut of ductile-brittle transition in the cutting of silicon is larger than that in the cutting of glass.
2001-01-05