縮少投影露光装置用の出口径の大きいエアマイクロ式位置保持機構の開発

概要

論文の詳細を見る
Reduction projection aligner needs a noncontact measurement means for the position of the wafer surface. A pneumatic gauge is suitable to detect the position of the wafer surface coated with several materials. The pneumatic gauge for this purpose has large outlet diameter which equals the reduction projection area. It must work under large operation gap and at the same time extremely low flow rate for semiconductor process. In this paper, design method and accuracy of the noncontact positioning apparatus with the large-outlet pneumatic gauge and some experimental results are described. Main results obtained are as follows : (1) Positioning accuracy depends mainly on pressure transducer accuracy. (2) Developed apparatus having a 20 mm outlet diameter, and a 90 μm gap, has achieved a positioning accuracy of 0.08 μm (3σ) under low flow rate (0.4l/min).
公益社団法人精密工学会の論文
1989-01-05