フィルドビア電気銅めっきにおけるフィリング性の電気化学的モニタリング法

概要

論文の詳細を見る
We have developed a method to monitor the time-dependent change in the filling capability of a via-hole filling copper electroplating solution. In this method, a rotating disk electrode is used to produce a controlled solution flow, and a constant current is applied to the rotating electrode in order to measure the potential value which is necessary to judge the filling capability. The obtained time-potential curves could be approximately fitted to a Boltzmann function to acquire the quantitative parameters required for judging the filling capability.
2005-07-01