Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test
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概要
- 論文の詳細を見る
- 2013-03-01
著者
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Wang Moo-chin
Department Of Mechanical Engineering National Kaohsiung Institute Of Technology
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Huang Hong-hsin
Department Of Electrical Engineering Cheng Shiu University
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Huang Hong-Hsin
Department of Electrical Engineering, Cheng Shiu University
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Hsi Chi-Shiung
Department of Materials Engineering, I-Show University
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LIN Ching-Tsung
Department of Materials Science and Engineering, National United University
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CHANG Tao-Chih
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
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LIANG Ming-Kann
Electronics and Optoelectronics Research Laboratories, Industrial Technology Research Institute
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- Microstructures Variations of Sn-9Zn-1Al and Sn-8Zn-3Bi Solder Pastes with Sn-3.8Ag-0.7Cu Solder Balls on OSP PCBs after Thermal Cycling Test