The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps
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概要
- 論文の詳細を見る
- 2011-11-01
著者
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Kim Young-ho
Division Of Materials Science & Engineering Hanyang University
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Dong Wen-guo
Division Of Materials Science & Engineering Hanyang University
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KIM Byeung
Division of Materials Science & Engineering, Hanyang University
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KIM Sun-Chul
Division of Materials Science & Engineering, Hanyang University
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Kim Byeung
Division Of Materials Science & Engineering Hanyang University
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Kim Sun-chul
Division Of Materials Science & Engineering Hanyang University
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Kim Young-ho
Division Of Biotechnology College Of Environmental & Bioresource Sciences Chonbuk National University
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- The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps
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