Non-Conductive Adhesive (NCA) Trapping Study in Chip on Glass Joints Fabricated Using Sn Bumps and NCA
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2008-09-01
著者
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Lee Sang-mok
Division Of Materials Science & Engineering Hanyang University
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Kim Young-ho
Division Of Materials Science & Engineering Hanyang University
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KIM Byeung-Gee
Division of Materials Science & Engineering, Hanyang University
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Kim Byeung-gee
Division Of Materials Science & Engineering Hanyang University
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Kim Young-ho
Division Of Biotechnology College Of Environmental & Bioresource Sciences Chonbuk National University
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