Fine Pitch and Low Temperature Bonding Using Solder Bumps and the Assessment of Solder Joint Reliability
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概要
- 論文の詳細を見る
- Japan Institute of Metalsの論文
- 2007-01-01
著者
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Chung Seung-min
Division Of Materials Science & Engineering Hanyang University
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Kim Young-ho
Division Of Materials Science & Engineering Hanyang University
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Kim Young‐ho
Division Of Materials Science & Engineering Hanyang University
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Kim Young-ho
Division Of Biotechnology College Of Environmental & Bioresource Sciences Chonbuk National University
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