Adhesion Strength for Copper (Cu) Clad Laminate of Cu Foil / γ-aminopropyltrimethoxysilane (γ-APS) / Epoxy Resin

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概要

• 論文の詳細を見る
• 日本材料科学会の論文
• 2006-12-20

著者

• TAKAHASHI Masaru

  関東学院大学大学院工学研究科

• YAMASHITA Tsugito

  関東学院大学工学部

• Yamashita Tsugito

  Department Of Applied Material And Life Science Kanto Gakuin University

• Takahashi Masaru

  Kanto Gakuin Univ. Kanagawa Jpn

関連論文

• Adhesion Strength for Copper (Cu) Clad Laminate of Cu Foil / Bisfunctional Silane / Epoxy Resin
• Thin Film Deposition of Photoluminescent Silicone Rubber by Pulsed Laser Deposition
• Photocatalytic TiO_2 Fine Particle Films Fabricated by Pulsed Laser Deposition
• Area-Selective Deposition of Diamond-Like Carbon Films onto Silicone Rubber by Femtosecond Laser
• Adhesion Strength for Copper (Cu) Clad Laminate of Cu Foil / γ-aminopropyltrimethoxysilane (γ-APS) / Epoxy Resin
• White-Light Emission from Silicone Rubber Modified by 193 nm ArF Excimer Laser
• Photochemical Modification of Silicone Films Using F2 Laser for Selective Chemical Etching
• Effect of SPS Adsorption on the Copper Electrodeposition in Acid Copper Sulfate Bath

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