Interfacial Microstructure and Joint Properties of Copper Direct Bond Inserted by the Thin Film of Indium
スポンサーリンク
概要
- 論文の詳細を見る
- 2004-09-15
著者
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Goto Tomoaki
Fuji Electric Advanced Technology Co. Ltd Production Technology Laboratory
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Fujimoto Kozo
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
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Fujimoto Kozo
Osaka Univ. Graduate School Of Eng. Dept. Of Manufacturing Science
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Yasuda Kiyokazu
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
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Yasuda Kiyokazu
Osaka Univ. Graduate School Of Eng. Dept. Of Manufacturing Science
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Taniguchi Katsumi
Fuji Electric Advanced Technology Co. Ltd Production Technology Laboratory
関連論文
- Toughening mechanism and frontal process zone size of ceramics
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- Interfacial Microstructure and Joint Properties of Copper Direct Bond Inserted by the Thin Film of Indium
- Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers