Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers
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概要
- 論文の詳細を見る
- 2005-09-13
著者
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Fujimoto Kozo
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
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Yasuda Kiyokazu
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
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OHTA Koushi
Osaka Univ. Dept. of Materials and Manufacturing Science, Graduate School of Eng.
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MATSUSHIMA Michiya
Osaka Univ. Dept. of Materials and Manufacturing Science, Graduate School of Eng.
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Ohta Koushi
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
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Matsushima Michiya
Osaka Univ. Dept. Of Materials And Manufacturing Science Graduate School Of Eng.
関連論文
- Interfacial Microstructure and Joint Properties of Copper Direct Bond Inserted by the Thin Film of Indium
- Numerical Study of the Self-Interconnection Assembly Method Using Resin Containing Solder Fillers