Multi-wire Slicing Method for Silicon Ingot with Electrical Discharge Machining
スポンサーリンク
概要
- 論文の詳細を見る
- 2007-11-28
著者
-
OKADA Akira
Graduate School of Engineering, Hokkaido University
-
Okamoto Y
Graduate School Of Natural Science And Technology Okayama University
-
OHSHITA Satoru
Graduate School of Natural Science and Technology, Okayama University
-
UNO Yoshiyuki
Graduate School of Natural Science and Technology, Okayama University
-
OKAMOTO Yasuhiro
Graduate School of Natural Science and Technology, Okayama University
-
HIRANO Tameyoshi
Toyo Advanced Technologies Corporation
-
TAKATA Shiro
Makino Milling Machine Corporation
-
Ohshita Satoru
Graduate School Of Natural Science And Technology Okayama University
-
Okamoto Yasuhiro
Graduate School Of Natural Science And Technology Okayama University
-
Uno Yoshiyuki
Graduate School Of Natural Science And Technology Okayama University
-
Okada Akira
Graduate School Of Natural Science And Technology Okayama University
-
Okada Akira
Graduate School Of Blosczence And Biotechnology Tokyo Institute Of Technology:research Center For Al
関連論文
- Electron Microscopy of La_Ca_MnO_3
- Magnetic microstructure of NiFe/Cu/NiFe films observed by Lorentz microscopy
- Ion-Shadow Sputter for the Production of STM Tips
- Transmission electron microscopy of La_Ca_ MnO_3 CMR films
- An Error Detect and Correct Circuit Based Fault-tolerant Reconfigurable Logic Device
- Multi-wire Slicing Method for Silicon Ingot with Electrical Discharge Machining
- Fundamental Study on Multi-wire EDM Slicing for Monocrystalline Ingot : Effects of Supply Method of Working Fluid and Wire Speed on Machining Characteristics(Electrical machining)
- A New Slicing Method of Monocrystalline Silicon Ingot by Wire EDM
- EDM Characteristics of CVD-Carbon Electrode
- 3P328 I_κB_αのNF-_κB活性化制御機構の1分子イメージング解析(バイオイメージング,第48回日本生物物理学会年会)