銅箔とプリント樹脂基板の密着性におけるエージング処理の影響

概要

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It would be expected that the corrosion phenomenon may also be altered among the planes, since the zinc is deposited in preferred orientation. In the present study, we investigated the effect on adhesion between the orientation of zinc plating on copper foils and peel loss after HCl immersion, after the electro-galvanized copper foils were exposed to the aging atmosphere (313 K, 90%RH, 7 days). The experimental results indicated that the foils plating (0002) oriented zinc basal plane had a lower peel loss after HCl immersion than the other orientations.The XPS (X-ray Photoelectron Spectroscopy) and rf-GDOES (rf-Glow Discharge Optical Emission Spectroscopy) studies were performed to support the mechanism of the peel loss after HCl immersion. It was found that it was difficult to oxidate the zinc layer of the (0002) oriented specimen, rather than the other orientations, after the aging test. It is considered that the oxidation of zinc results in a change of the layer structure on the surface of the foils, and hence the peel loss took place after HCl immersion.
2006-05-01