Comparison in Splitting Bonded SOI by Solid and Fluid Wedges (Water and Air Jets)

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概要

• 論文の詳細を見る
• 2000-08-28

著者

• Yonehara Takao

  Eltran Project R&d Headquarters Canon Inc.

• Yonehara Takao

  Eltran Business Center Canon Inc.

• Ohmi Kazuaki

  Eltran Business Center Canon Inc.

• SAKAGUCHI Kiyofumi

  ELTRAN Project, Device Development Center, Canon Inc.

• Sakaguchi Kiyofumi

  Eltran Business Center Canon Inc.

• YANAGITA Kazutaka

  ELTRAN Business Center, Canon Inc.

• KURISU Hirokazu

  ELTRAN Business Center, Canon Inc.

• SUZUKI Hirokazu

  ELTRAN Business Center, Canon Inc.

• Yanagita Kazutaka

  Eltran Business Center Canon Inc.

• Suzuki Hirokazu

  Eltran Business Center Canon Inc.

• Kurisu Hirokazu

  Eltran Business Center Canon Inc.

関連論文

• Thermal Stress Relaxation in GaAs Layer on New Thin Si Layer over Porous Si Substrate Grown by Metalorganic Chemical Vapor Deposition
• Comparison in Splitting Bonded SOI by Solid and Fluid Wedges (Water and Air Jets)
• Defect Engineering in Epitaxial Layers over Porous Silicon for ELTRAN^【○!R】 SOI Wafers
• Extremely Low Si Etching (
• Current Progress in Epitaxial Layer Transfer (ELTRAN^[○!R]) (Special Issue on SOI Devices and Their Process Technologies)
• Advanced Quality in Epitaxial Layer Transfer by Bond and Etch-Back of Porous Si
• Extremely High Selective Etching of Porous Si for Single Etch-Stop Bond-and-Etch-Back Silicon-on-Insulator

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