Interfacial Reaction and Morphology Between Molten Sn Base Solders and Cu Substrate

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概要

• 論文の詳細を見る
• Japan Institute of Metalsの論文
• 2004-03-20

著者

• Ishida Kiyohito

  Department of Materials Science, Graduate School of Engineering, Tohoku University

• Ohnuma Ikuo

  Department of Materials Science, Graduate School of Engineering, Tohoku University

• Liu Xing

  Department Of Materials Science Graduate School Of Engineering Tohoku University

• Kainuma R

  Institute Of Multidisciplinary Research For Advanced Materials Tohoku University

• Ohnuma I

  Tohoku Univ. Sendai Jpn

• Ohnuma Ikuo

  Department Of Materials Science Graduate School Of Engineering Tohoku University

• Takaku Yoshikazu

  CREST-JST, Dept. Mater. Sci., Tohoku University

• KAINUMA Ryosuke

  Department of Materials Science, Graduate School of Engineering, Tohoku University

• TAKAKU Yoshikazu

  Department of Materials Science, Graduate School of Engineering, Tohoku University

• Kainuma Ryosuke

  Department Of Materials Science Graduate School Of Engineering Tohoku University

• Kainuma Ryosuke

  Institute For Multidisciplinary Research For Advanced Materials Tohoku University

• Ishida Kiyohito

  Department Of Materials Science Faculty Of Engineering Tohoku University

• Liu Xing

  Department Of Cardiology Beijing Anzhen Hospital Capital Medical University

• Takaku Yoshikazu

  Crest-jst Dept. Mater. Sci. Tohoku University

• Ishida Kiyohito

  Department of Material Science, Graduate School of Engineering, Tohoku University, Sendai 980-8579, Japan

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