Wafer-Voltage Measurement in Plasma Processes by Means of a New Probe Method and an Impedance Monitor
スポンサーリンク
概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2004-03-15
著者
-
KANNO Seiichiro
Mechanical Engineering Research Laboratory, Hitachi, Ltd.
-
Nishio Ryoji
Hitachi High-technologies Corporation
-
Kanno Seiichiro
Mechanical Engineering Research Laboratory Hitachi Ltd.
-
TANAKA Junichi
Mechanical Engineering Research Laboratory, Hitachi, Ltd.
-
TETSUKA Tsutomu
Mechanical Engineering Research Laboratory, Hitachi, Ltd.
-
YAMAMOTO Hideyuki
Hitachi High-Technologies Corporation
関連論文
- A Novel Plasma Etching Tool with RF-Biased Faraday-Shield Technology : Chamber Surface Reaction Control in the Etching of Nonvolatile Materials
- Wafer-Voltage Measurement in Plasma Processes by Means of a New Probe Method and an Impedance Monitor
- A Novel Plasma Etching Tool with RF-Biased Faraday-Shield Technology: Chamber Surface Reaction Control in the Etching of Nonvolatile Materials
- Wafer-Voltage Measurement in Plasma Processes by Means of a New Probe Method and an Impedance Monitor