Issues and Reliability of High-Density FeRAMs
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概要
- 論文の詳細を見る
We discuss some technical issues on the realization of high-density ferroelectric random access memory (FeRAM). Due to reliability concerns of ferroelectric materials, such as fatigue, retention, and imprint, an extra sensing margin is required. In order to overcome these drawbacks, we have improved the ferroelectric capacitor process and design architecture. The fatigue and imprint degradations of the ferroelectric capacitor are significantly suppressed using the newly developed (Bi1-xLax)4Ti3O12 (BLT) films. The design architecture was improved using the split word line (SWL) cell array and current gain cell (CGC) operation. Using the above BLT capacitors and design architectures, we have obtained a high sensing margin, a high cell efficiency, and a small cross-talk noise in high-density FeRAMs.
- 公益社団法人 応用物理学会の論文
- 2003-04-15
著者
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Lee Seaung-suk
New Device Team Memory R&d Division Hynix Semiconductor Inc.
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Kang Hee-bok
New Device Team R&d Division Hynix Semiconductor Inc.
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Park Young-jin
New Device Team Memory R&d Division Hynix Semiconductor Inc.
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Lee Seok
New Device Team Memory R&d Division Hynix Semiconductor Inc.
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Yang Beelyong
Department of Materials Science & Engineering, Kumoh National Institute of Technology, 188 Shinpyong-dong, Gumi-si, Gyeongbuk 730-701, Korea
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Noh Keum
New Device Team, Memory R&D Division, Hynix Semiconductor Inc., San 136-1 Ami-ri Bubal-eub Ichon-si, Kyoungki-do 467-701, Korea
関連論文
- Imprint Characteristics of Ferroelectric Thin Films at Elevated Storage and Operation Temperatures
- Issues and Reliability of High-Density FeRAMs
- Issues and Reliability of High-Density FeRAMs
- Imprint Characteristics of Ferroelectric Thin Films at Elevated Storage and Operation Temperatures
- Issues and Reliability of High-Density FeRAMs