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Welding Research Institute of Osaka University | 論文
- Wetting and Reaction Products Formed at the Interface Between SiC and Cu-Ti Alloys
- Physical Meaning of Wetting Curve Traced by Meniscograph Wettability Tester (Report II) : Kinetic Consideration of Flux Action in Soldering(Welding Physics, Process & Instrument)
- Physical Meaning of Wetting Curve Traced by Meniscograph Wettability Tester(Welding Physics, Process & Instrument)
- High Rate Sputtering of Corrosion-Resistant Alloys(Welding Physics, Processes & Instruments)
- Fundamental Investigations on Solidification Crack Susceptibility for Weld Metals with Trans-Varestraint Test
- 10. Development of Computer Aided Process Planning System for Plate Bending by Line-Heating
- Interfacial Microstructure of Silicon Carbide and Titanium Aluminide Joints Produced by Solid-State Diffusion Bonding
- Solid State Diffusion Bonding of Silicon Nitride Using Vanadium Foils
- Solid State Diffusion Bonding of Silicon Nitride with Vanadium Foils(Materials, Metallurgy & Weldability)
- Interfacial Microstructure of Solid State Diffusion Bonded Silicon Nitride using Niobium Foils(Materials, Metallurgy & Weldability, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)
- Preparation of Amorphous Metallic Powder
- Weld Metal Cracking and Improvements of 25%Cr-20%Ni (AISI 310S) Fully Austenitic Stainless Steel
- Effect of Additional Element on Weld Solidification Crack Susceptibility of Al-Zn-Mg Alloy (Report I) : Results of Ring Casting Cracking Test(Materials, Metallurgy & Weldability)
- Assessment of Solidification Cracking Test for Aluminum Alloy Welds(MATERIALS METALLURGY AND WELDABILITY)
- Effect of the Third Alloying Elements on Surface Hardening of Ni-7wt%Ti and Ni-20wt%Cr Binary Alloys by PIN Process : Studies on Surface Modification of Nonferrous Metals by means of Plasma Ion Nitriding (PIN) Process (Report 5)
- Microstructure and Hardening Mechanism of Nitrided Ni Binary Alloys : Studies on Surface Modification of Nonferrous Metals by means of Plasma Ion Nitriding (PIN) Process (Report 4)
- Corrosion Behavior of Tentative Nickel Binary and Ternary Alloys after Plasma Ion Nitriding Treatment : Studies on Surface Modification of Non Ferrous Metals by means of Plasma Ion Nitriding (PIN) Process (Report 3)(Materials, Metallurgy & Weldability)
- Surface Hardening of Ni Alloys by Means of Plasma Ion Nitriding (PIN) Process (Report II) : Effect of Alloying Elements on Surface Hardening(Materials, Metallurgy & Weldability)
- Surface Hardening of Ni Alloys by Means of Plasma Ion Nitriding (PIN) Process (Report 1)(Materials, Metallurgy & Weldability)
- Surface Hardening of Ni-base Alloys with Boronizing Technique(Materials, Metallurgy & Weldability)
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