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Speedfam Co., Ltd. | 論文
- Study on the Mechanisms of Chemical Mechanical Polishing on Copper and Aluminum Surfaces Employing In Situ Infrared Spectroscopy
- A Study on Mechanism of Chemical Mechanical Polishing on Al and Cu Surfaces Employing In-situ Infrared Spectroscopy
- Study on the Mechanism of Silicon Chemical Mechanical Polishing Employing In Situ Infrared Spectroscopy
- Damage-Free Flattening Technology of Large Scale Si Wafer Employing Localized SF6/H2 Downstream Plasma
- Dry Cleaning Technology for Removal of Silicon Native Oxide Employing Hot NH_3/NF_3 Exposure
- Dishing-Free Cu Chemical Mechanical Polishing Process Based on Endpoint Detection with Laser Beam