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School of Mechanical Engineering, Chung-Ang University | 論文
- Wetting Transition Characteristics on Microstructured Hydrophobic Surfaces
- Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
- Optical Characteristics and Nanoscale Energy Transport in Thin Film Structures Irradiated by Nanosecond-to-Femtosecond Lasers
- Wave Interference Effect in Thin Film Structures under Pulsed Laser Irradiation
- Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Spectral and Angular Responses of Surface Plasmon Resonance Based on the Kretschmann Prism Configuration
- Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model
- Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Femtosecond Laser Pulse Train Effect on Optical Characteristics and Nonequilibrium Heat Transfer in Thin Metal Films
- Stability Analysis of a Pipe Conveying Periodically Pulsating Fluid Using Finite Element Method
- Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers
- Design and Fabrication of the Wireless Systems for Pressure Monitoring Systems in the Gastro-Intestinal Track(Biological Engineering)
- Comparison of Theoretical Models of Electron-Phonon Coupling in Thin Gold Films Irradiated by Femtosecond Pulse Lasers
- The Flexural and Tribological Behavior of Multi-Walled Carbon Nanotube-Reinforced Polyphenylene Sulfide Composites
- Flattening Characteristics of Ni_Cr Thermal-Sprayed Coating Layers on Preheated SCM415 Substrates
- Modeling of Droplet Collision Process in Inter-Spray Impingement System
- Dynamic Filling Characteristics of a Capillary Driven Underfill Process in Flip-Chip Packaging
- Properties Investigation on Chip-on-Film (COF) Thermosonic Bonding Using Anisotropic Conductive Films (ACFs)
- Effect of Flame Spray Distance on the Adhesive Characteristics of Ni-20mass%Cr Layers on SCM415 Substrates