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Process and Manufacturing Engineering Center, Toshiba Corporation | 論文
- Optimization of Polysilane Structure as Fast-Etching Bottom Antireflective Coating for Deep Ultraviolet Lithography
- A New Stacked-Mask Process Utilizing Spun-on Carbon Film for Sub-130-nm Etching
- Application of Organic Silicon Clusters to Pattern Transfer Process for Deep UV Lithography
- Fabrication of 0.2 μm Hole Patterns in KrF Excimer Laser Lithography
- Effect of Fe Doping of Thin (Ba,Sr)TiO_3 Films on Increase in Dielectric Constant