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Nanotechnology Research Laboratory, Waseda University | 論文
- Au-electrode-embedded cyclo-olefin polymer microchip using low-temperature direct bonding (特集 マイクロ加工および支援技術)
- Au-Electrode-Embedded Cyclo-Olefin Polymer Microchip Using Low-Temperature Direct Bonding
- Low-temperature Direct Bonding of Poly(methyl methacrylate) for Polymer Microchips
- MNS-05 ENHANCED RAMAN SPECTROSCOPIC ANALYSIS OF ULTRA-THIN PLASMA CVD DIAMOND-LIKE CARBON FILMS USING MOLECULAR SENSOR WITH PLASMON ANTENNA(Micro/Nanosystem Science and Technology II,Technical Program of Oral Presentations)
- Simplified 20-μm Pitch Vertical Interconnection Process for 3D Chip Stacking
- Fabrication of Metallic Nanopatterns Using the Vacuum Type UV-NIL Equipment
- Single Grain and Single Grain Boundary Resistance of Pentacene Thin Film Characterized by Nano-scale Electrode Array
- Fabrication of Planar Nano-gap Electrodes for Single Molecule Evaluation
- Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles
- Single Grain and Single Grain Boundary Resistance of Pentacene Thin Film Characterized Using a Nanoscale Electrode Array