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IBM Japan Ltd. | 論文
- Underfill Parameter Optimization Study for Mobile Products with Numerical Analysis
- Physical Interpretation of Current Start-Up by rf in WT-2 Tokamak
- High-Level Synthesis for Weakly Testable Data Paths(Special Issue on Test and Diagnosis of VLSI)
- Development of Compact and Precise Design Approach for Multiple Heated Materials with Thermal Design Parameter Optimization
- Morphotropic Phase Boundary and Dielectric Properties of V_2O_5-Containing Sr_xBa_Nb_2O_6 (0.2 ≤ x ≤ 0.4) Ferroelectrics
- Effect of Additives on Microstructure Development and Ferroelectric Properties of Sr_Ba_Nb_2O_6 Ceramics ( FERROELECTRIC MATERIALS AND THEIR APPLICATIONS)
- Application of Neural Network-Based Servo Controller to Position, Force and Stabbing Control by Robotic Manipulator
- Differential Analog Data Path Offset Calibration Method
- SA-3-1 AN INTERPOLATION ARCHITECTURE FOR CVSD AUDIO CODEC
- A-3-6 VARIABLE SOURCE CMOS CIRCUIT FOR LOW POWER APPLICATIONS
- Differential Analog Data Path DC Offset Calibration Methods (Special Section on Analog Circuit Techniques and Related Topics)
- Formulation of Rigid Multibody Systems in Space
- 208 直交関数系を用いたはりのパラメータ同定
- 9. Numerical and Experimental Studies on the Crashworthiness of Structural Members
- 2205 A Study on the Relationship between Project Management Capability and Vendor's Customer Satisfaction : Project Management and Customer Satisfaction
- Oscillatory Characteristics of a Pseudo-Shock Wave in a Rectangular Straight Duct
- SA-10-1(010) Creep and Creep Rupture of Sn-37Pb and Sn-95Pb Solders(Life Prediction of Solder)
- Optimal Thermo-Structural Analysis for High Density Package Mounting on Build-up Board
- Optimal Design and Dimensionless Correlation Development for Natural Convection Cooling Board
- OS10(2)-5(OS10W0102) Standard Mechanical Testings for Solders : JSMS Recommendation