Optimal Design and Dimensionless Correlation Development for Natural Convection Cooling Board
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概要
- 論文の詳細を見る
This paper focuses on the many parameters of PCB (Printed Circuit Board) that might affect on heat flow in the PCB. The parameter study found some guidelines that contribute to provide effective cooling PCB structure, and the study also found that the PCB structure affects temperature distribution of the PCB. Such heat transfer brings up many factors, however dimensionless analysis is considered appropriate way to study this complex heat transfer. Non-dimensional correlation between Nusselt number (Nu) and Grashoff number (Gr), dedicated to high-density PCB, was derived in natural convection cooling system. For the verification of the correlation, experimental simulation was performed in basis of several PCB properties. And unique definitions were given to dimensionless numbers.
- 社団法人 電気学会の論文
- 2003-07-01
著者
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Nakanishi Tohru
Ibm Japan Ltd. Yokohama
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Nakanishi T
Ibm Japan Ltd. Yasu
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Hase Tomohiro
Ryukoku University
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Hase Tomohiro
Ryukoku Universuty
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SHIMOHASHI Koki
IBM Japan, Ltd. Yasu
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Shimohashi Koki
Ibm Japan Ltd. Yasu
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Nakanishi Tohru
Ibm Japan Ltd.
関連論文
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- Optimal Thermo-Structural Analysis for High Density Package Mounting on Build-up Board
- Optimal Design and Dimensionless Correlation Development for Natural Convection Cooling Board