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Department of Electronic Engineering, Yeojoo Institute of Technology | 論文
- Aging Treatment Characteristics of Shear Strength in Micro Solder Bump
- Microstructures and Shear Strength of Interfaces between Sn-Zn Lead-free Solders and Au/Ni/Cu UBM
- Shear Strength in Solder Bump Joints for High Reliability Photodiode Packages
- High-resolution transmission electron microscopy and electron energy-loss spectroscopy study of polycrystalline-Si/ZrO_2/SiO_2/Si metal-oxide-semiconductor structures