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Department Of Materials Science And Engineering Ibaraki University | 論文
- アルミニウム合金の結晶粒微細化とセミソリッドフォーミング
- Impact of High Heating Rate, Low Temperature, and Short Time Annealing on the Realization of Low Resistivity Cu Wire
- 溶融純アルミニウムの水素溶解度
- Al-Si合金鋳塊中の水素拡散とミクロ組織の関係
- Al-Cu合金鋳物中の水素拡散係数
- Al-Cu合金中の水素溶解度
- 5p-E4-10 Henley型2次元準結晶モデルの格子力学
- 26a-E-9 2次元ペンローズ・パタンの安定性
- Transport and Deposition of Halide in Alkali Metal-Stainless Steel Systems, (IV)Measurement of Sodium Iodide Solubility in Sodium with Major Constituents of Stainless Steel and Oxide in Sodium
- Molecular Dynamics Simulation of Grain Growth of Cu Film : Effects of Adhesion Strength between Substrate and Cu Atoms
- Molecular Dynamics Simulation of Void Generation during Annealing of Copper Wiring
- 金属多層膜Cu/Ni,Cu/Agの超微小硬度
- 金属多層膜の作製とその構造評価
- Influence on the Electro-Migration Resistance by Line Width and Average Grain Size along the Longitudinal Direction of Very Narrow Cu Wires
- Influence of Magnetic Fields on α/γ Equilibrium in Fe-C(-X) Alloys
- Monte Carlo Simulation of Growth Process of Two-Dimensional Quasicrystal
- Computer Simulation of Growth Process of Binary Quasi Crystal
- Computer Simulation of Film Growth Process on the Two-Dimensional Penrose Pattern
- Microstructures of 50-nm Cu Interconnects along the Longitudinal Direction
- Influence of Grain Size Distributions on the Resistivity of 80nm Wide Cu Interconnects