Chang Wen-Hsiung | Winbond Electronics Corporation, Taichung 428, Taiwan

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LIN Chen-Hsi
Winbond Electronics Corp.
Chang Wen-Hsiung
Winbond Electronics Corporation, Taichung 428, Taiwan
Jang Wen-Yueh
Winbond Electronics Corporation, Taichung 428, Taiwan
Hou Tuo-Hung
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
LEE Yao-Jen
National Nano Device Laboratories
Lei Tan-fu
Department Of Electronic Engineering National Chiao Tung University
Lin Kuan-liang
Department Of Materials Science And Engineering National Cheng-kung University
Hou Tuo-Hung
Department of Electronics Engineering and Institute of Electronics, National Chiao-Tung University, Hsinchu 30010, Taiwan
Chou Cheng-Tung
Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan
Chang Jhe-Wei
Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan
Lin Jun-Hung
Department of Chemical and Materials Engineering, National Central University, Jhongli 320, Taiwan
Shieh Jiann
Department of Materials Science and Engineering, National United University, Miaoli 360, Taiwan
Lin Kuan-Liang
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
Lei Tan-Fu
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
Huang Jiun-Jia
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
Hsu Chung-Wei
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
Tseng Yi-Ming
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University, Hsinchu 300, Taiwan
Lin Chen-Hsi
Winbond Electronics Corporation, Taichung 428, Taiwan

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