GOSELE U. | School of Engineering, Duke University
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概要
School of Engineering, Duke University | 論文
- Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding
- A New Evaluation Method of Silicon Wafer Bonding Interfaces and Bondinug Strength by KOH Etching
- Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom
- Water-Enhanced Debonding of Room-Temperature Bonded Silicon Wafers for Surface Protection Applications