Water-Enhanced Debonding of Room-Temperature Bonded Silicon Wafers for Surface Protection Applications

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概要

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• Reversible bonding of silicon wafers can be used to protect mirror polished silicon surface against organic contamination and particles. The present paper will report on debonding experiments of room-temperature bonded wafer pairs. It is found the water can significantly enhance the equilibrium crack length created by a blade inserted between two bonded wafers. A simple analytical model of this phenomenon is proposed which takes into account the interfacial energy between silicon and water. Combined with the "one-wafer bent" concept, it is anticipated that room-temperature reversibly bonded wafers with diameters up to 8 inches can be easily separated by using this technique. Water-enhanced debonding appears to be suitable for industrial applications due to its compatibility with main stream integrated circuit technology.

• 1992-11-15

著者

• Tong Qin-yi

  School Of Engineering Duke University

• Gosele Ulrich

  School Of Engineering Duke University

• GAFITEANU Roman

  School of Engineering, Duke University

• TONG Qin-Yi

  School of Engineering, Duke University

関連論文

• Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding
• A New Evaluation Method of Silicon Wafer Bonding Interfaces and Bondinug Strength by KOH Etching
• Water-Enhanced Debonding of Room-Temperature Bonded Silicon Wafers for Surface Protection Applications

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