Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1991-04-15
著者
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Feijoo Diego
School Of Engineering Duke University
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Lehmann Volker
School Of Engineering Duke University:(present Address)siemens Research Laboratories
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Stengl R
School Of Engineering Duke University:(present Address)siemens Research Laboratories
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MITANI Kiyoshi
School of Engineering, Duke University
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STENGL Reinhard
School of Engineering, Duke University
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GOSELE Ulrich
School of Engineering, Duke University
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MASSOUD Hisham
School of Engineering, Duke University
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Gosele Ulrich
School Of Engineering Duke University
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LEHMANN Volker
School of Engineering, Duke University:(Present address)Siemens Research Laboratories
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STENGL Reinhard
School of Engineering, Duke University:(Present address)Siemens Research Laboratories
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FEIJOO Diego
School of Engineering, Duke University
関連論文
- Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding
- A New Evaluation Method of Silicon Wafer Bonding Interfaces and Bondinug Strength by KOH Etching
- Water-Enhanced Debonding of Room-Temperature Bonded Silicon Wafers for Surface Protection Applications