Yuji Shimada | Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan
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概要
Shibaura Institute of Technology, Koto, Tokyo 135-8548, Japan | 論文
- Grain Growth Enhancement of Electroplated Copper Film by Supercritical Annealing
- Barrier Integrity of Electroless Diffusion Barriers and Organosilane Monolayer against Copper Diffusion under Bias Temperature Stress
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects
- Low-Resistance Metal Contacts for Nanocarbon/Cobalt Interconnects (Special Issue : Advanced Metallization for ULSI Applications)
- Current Induced Grain Growth of Electroplated Copper Film (Special Issue : Advanced Metallization for ULSI Applications)