Tsai Chia-Ming | Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.

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Chen Chin-hsiang
Department Of Electronic Engineering Cheng Shiu University
Tsai Chia-Ming
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Lin Wei-Chi
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 833, Taiwan, R.O.C.
Yang Ming-Han
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 833, Taiwan, R.O.C.
Liu Shih-Kun
Institute of Photonics and Communications, National Kaohsiung University of Applied Sciences, Kaohsiung 833, Taiwan, R.O.C.
Tsai Chia-Ming
Department of Electronic Engineering, National Kaohsiung University of Applied Sciences, Kaohsiung 833, Taiwan, R.O.C.
Chen Chin-Hsiang
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Tsai Yu-Hsuan
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Tsai Cheng-Nan
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Yen Shuo-Fu
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Su Peng-Yin
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Cheng Chung-Fu
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 830, Taiwan, R.O.C.
Chen Chin-Hsiang
Department of Electronic Engineering, Cheng Shiu University, Kaohsiung 833, Taiwan, R.O.C.
TSAI Yu-Hsuan
Department of Biomolecular Systems, Max Planck Institute of Colloids and Interfaces

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