Gosele U. | School Of Engineering Duke University

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概要

• 同名の論文著者
• School Of Engineering Duke Universityの論文著者

関連著者

• Gosele U.

  School Of Engineering Duke University

• AHN K.-Y.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University

• STENGL R.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University

• GOSELE U.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University

• Stengl R.

  Department Of Mechanical Engineering And Materials Science School Of Engineering Duke University

• Ahn K.-y.

  Department Of Mechanical Engineering And Materials Science School Of Engineering Duke University

• Gosele U.

  Department Of Mechanical Engineering And Materials Science School Of Engineering Duke University

• Yang W.-s.

  Department Of Mechanical Engineering And Materials Science School Of Engineering Duke University

• Goesele U

  School Of Engineering Duke University

• LEHMANN V.

  School of Engineering, Duke University

• MITANI K.

  School of Engineering, Duke University

• STENGL R.

  School of Engineering, Duke University

• MII T.

  School of Engineering, Duke University

• MARIOTON B.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University

• Stengl R

  School Of Engineering Duke University:(present Address)siemens Ag Research Laboratories

• Lehmann V.

  School Of Engineering Duke University

• Mii T.

  School Of Engineering Duke University

• Mitani K.

  School Of Engineering Duke University:(present Address)shin-etsu Handotai R&d

• YANG W.-S.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University

• STENGL R.

  Department of Mechanical Engineering and Materials Science, School of Engineering, Duke University:(Present address) Siemens AG, Research Laboratories

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著作論文

• Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom
• Gold Gettering in Directly Bonded Silicon Wafers
• Bubble-Free Silicon Wafer Bonding in a Non-Cleanroom Environment : Semiconductors and Semiconductor Devices

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