NISHII Osamu | SuperH (Japan) Ltd.
スポンサーリンク
概要
関連著者
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石川 誠
東京工業大学 工学部
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石川 誠
(株)日立製作所中央研究所
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Nishii Osamu
Renesas Technology Corp.
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Hayashi T
Superh Japan Ltd.
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ARAKAWA Fumio
Central Research Laboratory, Hitachi, Ltd.
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ISHIKAWA Makoto
Central Research Laboratory, Hitachi, Ltd.
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KAMEI Tatsuya
Renesas Technology Corporation
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OZAWA Motokazu
Central Research Laboratory, Hitachi, Ltd.
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NISHII Osamu
SuperH (Japan) Ltd.
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Ishikawa Makoto
Hitachi America Ltd. Mi Usa
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Arakawa Fumio
Hitachi Ltd.
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Arakawa Fumio
Central Research Laboratory Hitachi Ltd.
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Ozawa Motokazu
Hitachi Ltd.
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Hayashi Tomoichi
Superh Japan Ltd.
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Ishikawa Makoto
Automotive Products Laboratory Hitachi America. Ltd.:(present Office)central Research Laboratory Hit
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Furuyama Mikio
Renesas Technology Corporation
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HAYASHI Tomoichi
SuperH Japan, Ltd.
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NISHIBORI Masakazu
Renesas Technology Corporation
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KONDO Yuki
Central Research Laboratory, Hitachi, Ltd.
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YAMAOKA Masanao
Central Research Laboratory, Hitachi, Ltd.
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SHIMAZAKI Yasuhisa
SuperH (Japan) Ltd.
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TAMAKI Saneaki
Renesas Technology Corporation
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HOSHI Tadashi
Renesas Technology Corporation
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HIROSE Kenji
Renesas Technology Corporation
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YOSHIOKA Shinichi
Renesas Technology Corporation
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HATTORI Toshihiro
Renesas Technology Corporation
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HATTORI Toshihiro
SuperH Japan, Ltd.
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YOSHINAGA Takeshi
SuperH Japan, Ltd.
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KIYOSHIGE Yoshikazu
SuperH Japan, Ltd.
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OKADA Takashi
Central Research Laboratory, Hitachi, Ltd.
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KODAMA Tomoyuki
Central Research Laboratory, Hitachi, Ltd.
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Kiyoshige Yoshikazu
Superh Japan Ltd.
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Tamaki Saneaki
Semiconductor & Integrated Circuits Hitachi Ltd.
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Yamaoka Masanao
Hitachi Ltd. Kokubunji‐shi Jpn
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Yamaoka Masanao
Central Research Laboratory Hitachi Ltd.
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Kodama Tomoyuki
Central Research Laboratory Hitachi Ltd.
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Hoshi Tadashi
Renesas Technology Corp.
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Hattori Toshihiro
Renesas Technology
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Kondo Yuki
Central Research Laboratory Hitachi Ltd.
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Yoshinaga Takeshi
Superh Japan Ltd.
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Okada Takashi
Central Res. Inst. Ishihara Sangyo Kaisha Ltd. Kusatsu 525-0025 Jpn
著作論文
- A 4500 MIPS/W, 86μA Resume-Standby, 11μA Ultra-Standby Application Processor for 3G Cellular Phones(Digital, Low-Power LSI and Low-Power IP)
- An Embedded Processor Core for Consumer Appliances with 2.8GFLOPS and 36 M Polygons/s FPU(System Level Design)(VLSI Design and CAD Algorithms)