Ishizuka M. | Research and Development Center
スポンサーリンク
概要
Research and Development Center | 論文
- Thin Film Deposition by Low Energy SiCl^+_n Beam
- Resist and Sidewall Film Rermoval after AT Reactive Ion Etching (RIE) Employing F+H_2O Downstream Ashing
- Cl_2/Ar Plasma Etching of a Contaminated Layer on Si Induced by Fluorocarbon Gas Plasma
- Fabrication and Evaluation of Three-Dimensional Optically Coupled Common Memory
- Si and SiO_2 Etching Characteristics Using Reactive Ion Etching with CF_4-Cl_2 Gas Mixture