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The Japan Institute of Electronics Packaging | 論文
- Analysis of Complete Power-Distribution Network and Co-Design Optimization
- 詳細人体モデルおよび簡略多層モデルを用いた人体通信送信機の入力インピーダンス解析
- Advanced IC Packaging Center in I-Shou University
- JIEP & CPMT
- 特集に寄せて
- 電子回路検査の方向と課題
- Thanks to members!
- High Heat Proofing Nano-Layered Film Cu Wiring Using Crystal Grain Growth Control
- Adhesion Improvement on Smooth Cu Wiring Surfaces of Printed Circuit Boards
- A New Contact Probe without Cleaning Process
- Trans. JIEP shall keep flying high in the future
- Effect on Wire Bondability of Electroless Ternary Ni Alloy as an Intermediate Film between Au and Cu Pads
- エレクトロニクス実装技術の変遷と将来に向けて
- Thermal Characterization of a Three-Dimensional (3D) Chip Stack
- Cu-Sn-Zr-P Alloy for a High-Strength Heat-Exchanger Tube
- 国士舘大学 理工学部電子情報学系 越地研究室
- Intention to the Special Edition
- Cooling Performance of a Two-Phase (Vapor-Liquid) Flow-Cooling System
- 鉛フリー無電解Niめっき皮膜中の共析物がはんだ実装信頼性に及ぼす影響
- ナノギャップ構造を用いた，不揮発抵抗スイッチ効果